Today, a team of scientists from the University of California, San Diego, have unveiled a new path forward for achieving dense photonic integration. This breakthrough, which could enable the integration of hundreds of optical components on a single chip, could lead to the development of faster and more efficient optical devices for use in a wide range of applications. The team has developed a new fabrication technique which they have named “Hybrid Photonic Integration on Silicon,” or HPI-Si, that allows for the integration of both optical and electrical elements on the same chip. This process uses a combination of direct laser writing, etching, and lithography techniques to create an array of optical components on a single chip. The team’s research has the potential to revolutionize optical device integration, and could lead to the development of a variety of next-generation optical systems.

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source: Phys.org