Scalable Manufacturing of Advanced Materials Made Possible with Atomic Layer Deposition
Atomic layer deposition (ALD) is set to revolutionize the way we manufacture semiconductors and other electronics. ALD is a thin film deposition technique that enables the deposition of ultra-thin films of material onto a substrate, layer-by-layer. This technique is highly precise and can be used to deposit thin films of materials with a high degree of accuracy, down to the single-atom level. ALD is also extremely scalable, meaning that it can be used to deposit films onto large-scale substrates, such as semiconductor wafers, with ease. This makes ALD a promising route to manufacturing semiconductors and other devices on an industrial scale.
source: Phys.org