Scientists Make Progress Toward Easy Creation of Atomically Thin Metal Layers
Scientists have recently discovered a new method for making atomically thin metal layers. This new method is simple and inexpensive, making it much easier to produce metal layers at the atomic level. These atomically thin layers have a variety of potential applications, including in nanoelectronics and optoelectronics.
The new method involves using a chemical vapor deposition (CVD) process to deposit metal layers onto a substrate and then exposing them to a high-energy electron beam. This beam causes the metal to break down into small clusters of metal atoms. The clusters then coalesce to form a single, atomically thin metal layer that is only a single atom thick. This method is much easier and cheaper than other methods for creating atomically thin layers, making it a great breakthrough for researchers.
source: Phys.org