A new metallization method has been developed by scientists at the Institute of Chemistry at the Chinese Academy of Sciences, which uses tannic acid as a photoresist. This method presents an alternative to traditional metal deposition techniques, such as electroless plating, and has the potential to be used in a wide range of applications.

The use of tannic acid as a photoresist offers a number of advantages. Firstly, it is much more environmentally friendly than other metal deposition techniques, as it produces no hazardous by-products. Additionally, the tannic acid can be applied to a wide range of substrates, including plastics, fabrics, and paper. Finally, the process is relatively simple and cost-effective, making it suitable for small-scale production.

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source: Phys.org