The future of electronics just got a whole lot thinner! Researchers have developed a new way to fabricate thin-film electronics by sandwiching layers of copper between two thin layers of diamond-like carbon. This groundbreaking technology could lead to faster, more efficient electronics, with applications in fields like healthcare and energy.

The team of researchers from the University of Manchester used a physical vapor deposition process to create the thin-film electronics, which consists of two layers of diamond-like carbon (DLC) with a thin layer of copper in between. This technique allowed for the fabrication of a highly conductive copper layer, which is essential for fast, efficient electronics. The copper layer is also highly resistant to corrosion, making it ideal for use in harsh environments.

The team believes that their new technique could revolutionize the electronics industry, enabling the creation of faster and more efficient devices. Additionally, this technology could be used to create energy-efficient electronics, with applications in healthcare, energy storage, and more. With the potential to revolutionize the electronics industry, this new technology is sure to be an exciting development in the world of electronics.

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source: Phys.org