Unlocking the Potential of Femtosecond Lasers for BIBurst Ablation in Silicon
Femtosecond lasers are revolutionizing the field of medical and scientific research. A new study published in the journal Nature Communications has demonstrated the potential of femtosecond lasers to achieve BiBurst ablation of silicon.
The study conducted by researchers at the University of Tokyo used an ultrafast laser to ablate a thin layer of silicon oxide. The results showed that BiBurst ablation of silicon oxide can be achieved with a femtosecond laser, allowing for precise control over the ablation process. The researchers suggest that this technology could be used to create micro- and nanostructures, such as trenches and holes, in a wide range of materials.
These findings open up new possibilities for applications in the medical and scientific fields, such as accurate fabrication of medical devices, drug delivery systems, and nanoscale structures. The successful demonstration of BiBurst ablation of silicon oxide with a femtosecond laser is an important step towards achieving more efficient and precise medical and scientific research.
source: Phys.org